A comparison of grinding forces arising from oscillating workpiece speed and chip thickness

Abstract

Chatter in grinding may involve both torsional and transverse vibration. The grinding force model used in the simulation of grinding, including torsional vibration, was derived from a model developed for a steady grinding situation. In some recent publications an experimental verification of the force model has been attempted. The major interest lies in the relationship between the oscillating force caused by any oscillating component of workpiece speed and/or any oscillating component of chip thickness. The force model used has assumed the oscillating force is proportional to both variables with the same constant of proportionality.