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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/72950
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dc.titleStudy of the microcracks on the alumina of the thin-film head
dc.contributor.authorChekanov, A.S.
dc.contributor.authorLow, T.S.
dc.contributor.authorAlli, S.
dc.date.accessioned2014-06-19T05:13:50Z
dc.date.available2014-06-19T05:13:50Z
dc.date.issued1995
dc.identifier.citationChekanov, A.S.,Low, T.S.,Alli, S. (1995). Study of the microcracks on the alumina of the thin-film head. Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA : 176-180. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/72950
dc.description.abstractA study of the microcracks found in the alumina of the magnetic thin film head is presented. The initiation and growth of the crack was simulated. Thermal expansion of the energized wires was found to produce high stress at the pole tip area resulting in the cracks being attracted to the pole tips. Damages on the alumina act as crack initiation sites. The presence of the crack through the head gap also affects the recording performance of the head.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL ENGINEERING
dc.contributor.departmentDATA STORAGE INSTITUTE
dc.description.sourcetitleProceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA
dc.description.page176-180
dc.description.coden00234
dc.identifier.isiutNOT_IN_WOS
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