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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/72808
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dc.titleNovel electrical performance analysis for leaded packages
dc.contributor.authorJin, Z.
dc.contributor.authorMa, J.
dc.contributor.authorIyer, M.K.
dc.contributor.authorOoi, B.L.
dc.contributor.authorLeong, M.S.
dc.date.accessioned2014-06-19T05:12:12Z
dc.date.available2014-06-19T05:12:12Z
dc.date.issued1998
dc.identifier.citationJin, Z.,Ma, J.,Iyer, M.K.,Ooi, B.L.,Leong, M.S. (1998). Novel electrical performance analysis for leaded packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 101-104. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/72808
dc.description.abstractThis paper presents a novel analysis of electrical performance in 208PQFP. S-parameters are used to model the package leads. Simultaneous switching noise (SSN) is analysed both in time and frequency domain. Higher frequency effects, such as resonance and reflection are also included in this simulation study.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.contributor.departmentELECTRICAL ENGINEERING
dc.description.sourcetitleIEEE Topical Meeting on Electrical Performance of Electronic Packaging
dc.description.page101-104
dc.description.coden00174
dc.identifier.isiutNOT_IN_WOS
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