Please use this identifier to cite or link to this item: https://doi.org/10.1109/ISNE.2013.6512342
DC FieldValue
dc.titleXOXO: Haptic interface for mediated intimacy
dc.contributor.authorSamani, H.
dc.contributor.authorTeh, J.
dc.contributor.authorSaadatian, E.
dc.contributor.authorNakatsu, R.
dc.date.accessioned2014-06-19T03:32:50Z
dc.date.available2014-06-19T03:32:50Z
dc.date.issued2013
dc.identifier.citationSamani, H.,Teh, J.,Saadatian, E.,Nakatsu, R. (2013). XOXO: Haptic interface for mediated intimacy. ISNE 2013 - IEEE International Symposium on Next-Generation Electronics 2013 : 256-259. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ISNE.2013.6512342" target="_blank">https://doi.org/10.1109/ISNE.2013.6512342</a>
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/72219
dc.description.abstractDespite advances in telecommunication technologies, remote communication is still not as convincing as face to face communication, since haptic sense, as an important medium of expressing affection, is missing. In this paper, we describe a frameworks for reinforcing advantages of the intimate haptics sensation to exchange feelings and increase the sense of presence in a remote caring communication as well as XOXO prototype of intimate haptics interface for interpersonal communication through hugging and kissing. XOXO facilitates physical interaction in a remote communication between humans by enabling to kiss and hug one another through robotics interface and wearable hug reproducing jacket. The objective of this system is to develop a computer mediated haptics stimulation platform which can produce almost similar affective response on humans relative to a real physical intimate haptics interaction. © 2013 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ISNE.2013.6512342
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/ISNE.2013.6512342
dc.description.sourcetitleISNE 2013 - IEEE International Symposium on Next-Generation Electronics 2013
dc.description.page256-259
dc.identifier.isiutNOT_IN_WOS
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