Please use this identifier to cite or link to this item: https://doi.org/10.1109/EDAPS.2008.4736027
DC FieldValue
dc.titleThermal-aware electrical analysis of high-speed interconnect
dc.contributor.authorLiu, E.-X.
dc.contributor.authorLi, E.-P.
dc.contributor.authorWei, X.
dc.date.accessioned2014-06-19T03:30:28Z
dc.date.available2014-06-19T03:30:28Z
dc.date.issued2008
dc.identifier.citationLiu, E.-X., Li, E.-P., Wei, X. (2008). Thermal-aware electrical analysis of high-speed interconnect. 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings : 171-174. ScholarBank@NUS Repository. https://doi.org/10.1109/EDAPS.2008.4736027
dc.identifier.isbn9781424426331
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/72015
dc.description.abstractThis paper studied the problem of coupled electrical and thermal modeling, specifically for the signal integrity analysis of on-chip interconnect due to the influence of substrate and interconnect temperature. The approach presented in this paper is using finite-difference method (FDM) to solve for the temperature profile of the substrate. The information of the substrate temperature is used for subsequent thermal modeling of the interconnect. The ID thermal modeling of the interconnect is done by using an equivalent thermal circuit model, which is compatible with the SPICE simulator and can fast produce the temperature profile of the interconnect. Numerical examples are presented, which show that the temperature of the interconnect affects the electrical performance of the interconnect. © 2008 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EDAPS.2008.4736027
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/EDAPS.2008.4736027
dc.description.sourcetitle2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
dc.description.page171-174
dc.identifier.isiut000265245200045
Appears in Collections:Staff Publications

Show simple item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

2
checked on May 12, 2022

Page view(s)

105
checked on May 12, 2022

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.