1. ScholarBank@NUS
  2. 1. Staff
  3. Staff Publications
Please use this identifier to cite or link to this item: https://doi.org/10.1109/ICUWB.2010.5615804
DC FieldValue
dc.titleHigh-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via
dc.contributor.authorGuo, Y.-X.
dc.contributor.authorChu, H.
dc.date.accessioned2014-06-19T03:12:33Z
dc.date.available2014-06-19T03:12:33Z
dc.date.issued2010
dc.identifier.citationGuo, Y.-X.,Chu, H. (2010). High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via. 2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings 1 : 34-37. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICUWB.2010.5615804" target="_blank">https://doi.org/10.1109/ICUWB.2010.5615804</a>
dc.identifier.isbn9781424453061
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70475
dc.description.abstractIn this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated. © 2010 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ICUWB.2010.5615804
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/ICUWB.2010.5615804
dc.description.sourcetitle2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings
dc.description.volume1
dc.description.page34-37
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

Show simple item record
Files in This Item:
There are no files associated with this item.

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.