Please use this identifier to cite or link to this item: https://doi.org/10.1109/TVLSI.2005.857177
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dc.titleEquivalent circuit model of on-wafer CMOS interconnects for RFICs
dc.contributor.authorShi, X.
dc.contributor.authorMa, J.-G.
dc.contributor.authorYeo, K.S.
dc.contributor.authorDo, M.A.
dc.contributor.authorLi, E.
dc.date.accessioned2014-06-19T03:09:20Z
dc.date.available2014-06-19T03:09:20Z
dc.date.issued2005-09
dc.identifier.citationShi, X., Ma, J.-G., Yeo, K.S., Do, M.A., Li, E. (2005-09). Equivalent circuit model of on-wafer CMOS interconnects for RFICs. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 13 (9) : 1069-1071. ScholarBank@NUS Repository. https://doi.org/10.1109/TVLSI.2005.857177
dc.identifier.issn10638210
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70195
dc.description.abstractThis paper investigates the properties of the on-wafer interconnects built in a 0.18-μm CMOS technology for RF applications. A scalable equivalent circuit model is developed. The model parameters are extracted directly from the on-wafer measurements and formulated into empirical expressions. The expressions are in functions of the length and the width of the interconnects. The proposed model can be easily implemented into commercial RF circuit simulators. It provides a novel solution to include the frequency-variant characteristics into a circuit simulation. The silicon-verified accuracy is proved to be up to 25 GHz with an average error less than 2%. Additionally, equivalent circuit model for longer wires can be obtained by cascading smaller subsections together. The scalability of the propose model is demonstrated. © 2005 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TVLSI.2005.857177
dc.sourceScopus
dc.subjectEmpirical formulas
dc.subjectLumped equivalent circuit model
dc.subjectModeling
dc.subjectRF CMOS interconnects
dc.subjectScalable
dc.subjectScattering parameters measurement
dc.subjectSkin effect
dc.subjectSubstrate losses
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/TVLSI.2005.857177
dc.description.sourcetitleIEEE Transactions on Very Large Scale Integration (VLSI) Systems
dc.description.volume13
dc.description.issue9
dc.description.page1069-1071
dc.description.codenIEVSE
dc.identifier.isiut000232942600005
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