Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2005.09.063
DC FieldValue
dc.titleElectrical characterization of platinum and palladium effects in nickel monosilicide/n-Si Schottky contacts
dc.contributor.authorJin, L.J.
dc.contributor.authorPey, K.L.
dc.contributor.authorChoi, W.K.
dc.contributor.authorAntoniadis, D.A.
dc.contributor.authorFitzgerald, E.A.
dc.contributor.authorChi, D.Z.
dc.date.accessioned2014-06-19T03:08:32Z
dc.date.available2014-06-19T03:08:32Z
dc.date.issued2006-05-10
dc.identifier.citationJin, L.J., Pey, K.L., Choi, W.K., Antoniadis, D.A., Fitzgerald, E.A., Chi, D.Z. (2006-05-10). Electrical characterization of platinum and palladium effects in nickel monosilicide/n-Si Schottky contacts. Thin Solid Films 504 (1-2) : 149-152. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.09.063
dc.identifier.issn00406090
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70124
dc.description.abstractThe current versus voltage (I-V) characteristics of Ni(Pt or Pd)Si/n-Si Schottky contacts annealed at 400 and 500 °C showed that the Schottky barrier height (SBH) of the contact increased from 0.67 to 0.80 eV with an addition of 10 at.% Pt into the Ni alloy film. On the other hand, both 5 and 10 at.% Pd resulted in the same amount of increase in the SBH. The forward-biased I-V characteristics of Ni alloy/Si contacts carried out at 93 to 300 K showed that at higher measured temperature (> 253 K), or at low measured temperature (< 253 K) but at higher bias (> 0.5 V), it can be modeled using the thermionic emission model with the SBH decreased and ideality factor increased with decreasing temperature. Excess current was observed when measured at T < 253 K and lower bias (< 0.5 V) which may be due to the local inhomogeneity of SBH. © 2005 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.tsf.2005.09.063
dc.sourceScopus
dc.subjectSBH inhomogeneity
dc.subjectSchottky barrier height (SBH)
dc.subjectThermionic emission model
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1016/j.tsf.2005.09.063
dc.description.sourcetitleThin Solid Films
dc.description.volume504
dc.description.issue1-2
dc.description.page149-152
dc.description.codenTHSFA
dc.identifier.isiut000236486200036
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