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Please use this identifier to cite or link to this item: https://doi.org/10.1109/ICSET.2008.4747067
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dc.titleDesign and modeling of vacuum packaged MEMS thermoelectric power generator using heat dissipation path
dc.contributor.authorXie, J.
dc.contributor.authorLee, C.
dc.date.accessioned2014-06-19T03:05:17Z
dc.date.available2014-06-19T03:05:17Z
dc.date.issued2008
dc.identifier.citationXie, J., Lee, C. (2008). Design and modeling of vacuum packaged MEMS thermoelectric power generator using heat dissipation path. 2008 IEEE International Conference on Sustainable Energy Technologies, ICSET 2008 : 542-545. ScholarBank@NUS Repository. https://doi.org/10.1109/ICSET.2008.4747067
dc.identifier.isbn9781424418886
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/69841
dc.description.abstractA new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 μW/cm2 for temperature difference of 6°C between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage. © 2008 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ICSET.2008.4747067
dc.sourceScopus
dc.subjectEnergy harvester
dc.subjectMEMS
dc.subjectPower generator
dc.subjectThermoelectric
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/ICSET.2008.4747067
dc.description.sourcetitle2008 IEEE International Conference on Sustainable Energy Technologies, ICSET 2008
dc.description.page542-545
dc.identifier.isiut000268749500106
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