Please use this identifier to cite or link to this item: https://doi.org/10.1361/cp2008istfa402
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dc.titleCombining refractive solid immersion lens and pulsed laser induced techniques for effective defect localization on microprocessors
dc.contributor.authorQuah, A.C.T.
dc.contributor.authorGoh, S.H.
dc.contributor.authorRavikumar, V.K.
dc.contributor.authorPhoa, S.L.
dc.contributor.authorNarang, V.
dc.contributor.authorChin, J.M.
dc.contributor.authorChua, C.M.
dc.contributor.authorPhang, J.C.H.
dc.date.accessioned2014-06-19T03:02:57Z
dc.date.available2014-06-19T03:02:57Z
dc.date.issued2008
dc.identifier.citationQuah, A.C.T., Goh, S.H., Ravikumar, V.K., Phoa, S.L., Narang, V., Chin, J.M., Chua, C.M., Phang, J.C.H. (2008). Combining refractive solid immersion lens and pulsed laser induced techniques for effective defect localization on microprocessors. Conference Proceedings from the International Symposium for Testing and Failure Analysis : 402-406. ScholarBank@NUS Repository. https://doi.org/10.1361/cp2008istfa402
dc.identifier.isbn9780871707147
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/69636
dc.description.abstractThe spatial resolution and sensitivity of laser induced techniques are significantly enhanced by combining refractive solid immersion lens technology and laser pulsing with lock-in detection algorithm. Laser pulsing and lock-in detection enhances the detection sensitivity and removes the 'tail' artifacts due to amplifier ac-coupling response. Three case studies on microprocessor devices with different failure modes are presented to show that the enhancements made a difference between successful and unsuccessful defect localization. Copyright © 2008 ASM International..
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1361/cp2008istfa402
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1361/cp2008istfa402
dc.description.sourcetitleConference Proceedings from the International Symposium for Testing and Failure Analysis
dc.description.page402-406
dc.identifier.isiut000288182500074
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