Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPEP.2007.4387177
DC FieldValue
dc.titleAn efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages
dc.contributor.authorLiu, E.-X.
dc.contributor.authorWei, X.
dc.contributor.authorOo, Z.Z.
dc.contributor.authorLi, E.-P.
dc.date.accessioned2014-06-19T02:59:09Z
dc.date.available2014-06-19T02:59:09Z
dc.date.issued2007
dc.identifier.citationLiu, E.-X.,Wei, X.,Oo, Z.Z.,Li, E.-P. (2007). An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 263-266. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPEP.2007.4387177" target="_blank">https://doi.org/10.1109/EPEP.2007.4387177</a>
dc.identifier.isbn1424408830
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/69304
dc.description.abstractWe developed a two-dimensional full wave method for efficient power integrity and EMI Analysis of general power/ground planes in high-speed electronic packages. The resultant equivalent magnetic source from the 2D simulation is used for EMI analysis via the free-space Green's function. Both analytical and experimental validation shows that the method is accurate and efficient. © 2007 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPEP.2007.4387177
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/EPEP.2007.4387177
dc.description.sourcetitleIEEE Topical Meeting on Electrical Performance of Electronic Packaging
dc.description.page263-266
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

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