Please use this identifier to cite or link to this item:
https://doi.org/10.1109/EPEP.2007.4387177
DC Field | Value | |
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dc.title | An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages | |
dc.contributor.author | Liu, E.-X. | |
dc.contributor.author | Wei, X. | |
dc.contributor.author | Oo, Z.Z. | |
dc.contributor.author | Li, E.-P. | |
dc.date.accessioned | 2014-06-19T02:59:09Z | |
dc.date.available | 2014-06-19T02:59:09Z | |
dc.date.issued | 2007 | |
dc.identifier.citation | Liu, E.-X.,Wei, X.,Oo, Z.Z.,Li, E.-P. (2007). An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 263-266. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPEP.2007.4387177" target="_blank">https://doi.org/10.1109/EPEP.2007.4387177</a> | |
dc.identifier.isbn | 1424408830 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/69304 | |
dc.description.abstract | We developed a two-dimensional full wave method for efficient power integrity and EMI Analysis of general power/ground planes in high-speed electronic packages. The resultant equivalent magnetic source from the 2D simulation is used for EMI analysis via the free-space Green's function. Both analytical and experimental validation shows that the method is accurate and efficient. © 2007 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPEP.2007.4387177 | |
dc.source | Scopus | |
dc.type | Conference Paper | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/EPEP.2007.4387177 | |
dc.description.sourcetitle | IEEE Topical Meeting on Electrical Performance of Electronic Packaging | |
dc.description.page | 263-266 | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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