Please use this identifier to cite or link to this item: https://doi.org/10.1109/EMCZUR.2007.4388240
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dc.titleA SPICE-compatible full-wave equivalent circuit model for printed circuit structure analysis
dc.contributor.authorChua, E.-K.
dc.contributor.authorLi, E.-P.
dc.contributor.authorSee, K.-Y.
dc.contributor.authorYin, W.
dc.date.accessioned2014-06-19T02:56:40Z
dc.date.available2014-06-19T02:56:40Z
dc.date.issued2007
dc.identifier.citationChua, E.-K.,Li, E.-P.,See, K.-Y.,Yin, W. (2007). A SPICE-compatible full-wave equivalent circuit model for printed circuit structure analysis. Proceedings of the 18th International Zurich Symposium on Electromagnetic Compatibility, EMC : 241-244. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EMCZUR.2007.4388240" target="_blank">https://doi.org/10.1109/EMCZUR.2007.4388240</a>
dc.identifier.isbn9783952328606
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/69086
dc.description.abstractIn this paper, a SPICE-compatible full-wave equivalent circuit model, based on the method of moments, for three dimensional printed circuit structure has been developed. It could be easily integrated into any circuit-based simulator to analyze the effects of the printed circuit board interconnects on high-speed circuit performance. The predicted results using the method proposed in this paper and the experimental results are in good agreement.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EMCZUR.2007.4388240
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/EMCZUR.2007.4388240
dc.description.sourcetitleProceedings of the 18th International Zurich Symposium on Electromagnetic Compatibility, EMC
dc.description.page241-244
dc.identifier.isiutNOT_IN_WOS
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