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dc.titleA novel wafer baking system using hot air streams
dc.contributor.authorLan, W.
dc.contributor.authorLoong, C.S.
dc.contributor.authorPoh, L.A.
dc.contributor.authorMing, G.Z.
dc.contributor.authorWan, T.W.
dc.contributor.authorTay, A.
dc.contributor.authorKhuen, H.W.
dc.identifier.citationLan, W., Loong, C.S., Poh, L.A., Ming, G.Z., Wan, T.W., Tay, A., Khuen, H.W. (2004). A novel wafer baking system using hot air streams. Proceedings of SPIE - The International Society for Optical Engineering 5376 (PART 2) : 1233-1242. ScholarBank@NUS Repository.
dc.description.abstractThis paper presents a novel wafer baking system that uses hot air streams as heating media and achieves good temperature uniformity across the entire wafer surfaces during the baking process. Wind tunnel experiments have been carried out to verify the concept of using hot air streams for wafer baking. A simple prototyping wafer baking system has been designed and fabricated, and experiments of the baking process have been conducted. Good temperature uniformity across the wafer surface has been achieved. The experimental results match well with the computer fluid dynamics (CFD) simulation results. It is observed that the velocity of the airflow has significant influence on the temperature transient responses. Further optimization of the parameters of the baking system and analytical modelling studies are currently under way.
dc.subjectPost exposure bake (PEB)
dc.subjectTemperature uniformity
dc.subjectWafer-baking process
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.sourcetitleProceedings of SPIE - The International Society for Optical Engineering
dc.description.issuePART 2
Appears in Collections:Staff Publications

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