Please use this identifier to cite or link to this item: https://doi.org/10.1109/ISEMC.2005.1513556
DC FieldValue
dc.titleA novel integrated approach for simulation of electromagnetic susceptibility problem
dc.contributor.authorJin, H.-F.
dc.contributor.authorLi, E.-P.
dc.contributor.authorLiu, E.-X.
dc.date.accessioned2014-06-19T02:55:21Z
dc.date.available2014-06-19T02:55:21Z
dc.date.issued2005
dc.identifier.citationJin, H.-F.,Li, E.-P.,Liu, E.-X. (2005). A novel integrated approach for simulation of electromagnetic susceptibility problem. IEEE International Symposium on Electromagnetic Compatibility 2 : 446-450. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ISEMC.2005.1513556" target="_blank">https://doi.org/10.1109/ISEMC.2005.1513556</a>
dc.identifier.isbn0780393805
dc.identifier.issn10774076
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/68971
dc.description.abstractThis paper presents a systematic approach for electromagnetic susceptibility (EMS) analysis of high speed circuit with the presence of an electromagnetic interference. With numerical analysis, the effect of external electromagnetic noise on the interconnect is characterized and modeled as equivalent current source. At the same time, the marcomodel of internet subnetwork is constructed through Vector fitting method. Then, the resultant marcromodel and equivalent current source are ready to be synthesized into SPICE-compatible circuit simulator to efficiently expedite the transient analysis of the hybrid interconnects and lumped circuit elements with the external electromagnetic interference. Numerical example exhibit s that this systematic approach is a computationally efficient method to solve the electromagnetic susceptibility problems, in which the external electromagnetic interference effects are fully considered. © 2005 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ISEMC.2005.1513556
dc.sourceScopus
dc.subjectElectromagnetic susceptibility analysis
dc.subjectEquivalent current source
dc.subjectFDTD macromodel
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/ISEMC.2005.1513556
dc.description.sourcetitleIEEE International Symposium on Electromagnetic Compatibility
dc.description.volume2
dc.description.page446-450
dc.description.codenIISPD
dc.identifier.isiutNOT_IN_WOS
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