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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/68892
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dc.titleA multilayer active hybrid-ring using ground-slot coupling technique
dc.contributor.authorHui, S.C.
dc.contributor.authorOoi, B.-L.
dc.contributor.authorLeong, M.S.
dc.contributor.authorKooi, P.S.
dc.date.accessioned2014-06-19T02:54:26Z
dc.date.available2014-06-19T02:54:26Z
dc.date.issued2003
dc.identifier.citationHui, S.C.,Ooi, B.-L.,Leong, M.S.,Kooi, P.S. (2003). A multilayer active hybrid-ring using ground-slot coupling technique. IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers : 651-654. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/68892
dc.description.abstractA ground-slot coupling technique is applied to design a novel multilayer active hybrid-ring power divider. The prototype consists of three ground slots to couple signal between circuit layers, and two single-stage HEMT amplifiers to boost the coupled signal. It is tested in C-band with 40% -3dB bandwidth. At 5GHz center frequency, it has 8dB small-signal gain and l0dBm output P1dB.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.sourcetitleIEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers
dc.description.page651-654
dc.identifier.isiutNOT_IN_WOS
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