Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.654331
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dc.titleA lamp thermoelectricity based integrated bake/chill system for advanced photoresist processing
dc.contributor.authorTay, A.
dc.contributor.authorChua, H.-T.
dc.contributor.authorWu, X.
dc.contributor.authorWang, Y.
dc.date.accessioned2014-06-19T02:53:53Z
dc.date.available2014-06-19T02:53:53Z
dc.date.issued2006
dc.identifier.citationTay, A., Chua, H.-T., Wu, X., Wang, Y. (2006). A lamp thermoelectricity based integrated bake/chill system for advanced photoresist processing. Proceedings of SPIE - The International Society for Optical Engineering 6153 II : -. ScholarBank@NUS Repository. https://doi.org/10.1117/12.654331
dc.identifier.isbn0819461962
dc.identifier.issn0277786X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/68847
dc.description.abstractThe design of an integrated bake/chill module for photoresist processing in microlithography is presented, with emphasis on the spatial and temporal temperature uniformity of the substrate. The system consists of multiple radiant heating zones for heating the substrate, coupled with an array of thermoelectric devices (TEDs) which provide real-time dynamic and spatial control of the substrate temperature. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. The use of lamp for radiative heating also provide fast ramp-up and ramp-down rates during thermal cycling operations. The feasibility of the proposed approach is demonstrate via simulations based on first principle heat transfer modeling. The distributed nature of the design also means that a simple decentralized control scheme can be used to achieve tight spatial and temporal temperature uniformity specifications.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1117/12.654331
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1117/12.654331
dc.description.sourcetitleProceedings of SPIE - The International Society for Optical Engineering
dc.description.volume6153 II
dc.description.page-
dc.description.codenPSISD
dc.identifier.isiut000238175500155
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