Please use this identifier to cite or link to this item: https://doi.org/10.1007/s00542-009-0933-z
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dc.titleDielectric materials for electrowetting-on-dielectric actuation
dc.contributor.authorLiu, H.
dc.contributor.authorDharmatilleke, S.
dc.contributor.authorMaurya, D.K.
dc.contributor.authorTay, A.A.O.
dc.date.accessioned2014-06-18T06:10:49Z
dc.date.available2014-06-18T06:10:49Z
dc.date.issued2010-03
dc.identifier.citationLiu, H., Dharmatilleke, S., Maurya, D.K., Tay, A.A.O. (2010-03). Dielectric materials for electrowetting-on-dielectric actuation. Microsystem Technologies 16 (3) : 449-460. ScholarBank@NUS Repository. https://doi.org/10.1007/s00542-009-0933-z
dc.identifier.issn09467076
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/68202
dc.description.abstractThe fundamental building blocks of typical electrowetting-on-dielectric (EWOD) actuation and their importance in the EWOD mechanism are introduced and reviewed, respectively. The emphasis in this experimental study of EWOD is on dielectric materials, upon which the performance of EWOD devices is heavily dependent. Dielectric breakdown of several typical polymeric and inorganic insulators employed as dielectrics for EWOD has been analytically investigated, which is forced to occur between the electrodes and conductive liquids under certain threshold potential. The electric breakdown occurring in both dielectric layer and surrounding medium (air or silicon oil) has been studied to build up a mathematical model of breakdown voltage as a function of dielectric thickness. Contact angle measurement of some polymeric materials and self-assembled monolayer using pure water has been carried out to demonstrate the contact angle tunability and reversibility, respectively, upon EWOD actuation. © 2009 Springer-Verlag.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1007/s00542-009-0933-z
dc.sourceScopus
dc.typeReview
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1007/s00542-009-0933-z
dc.description.sourcetitleMicrosystem Technologies
dc.description.volume16
dc.description.issue3
dc.description.page449-460
dc.identifier.isiut000273034700013
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