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Title: A review of board level solder joints for mobile applications
Authors: Wong, E.H.
Seah, S.K.W. 
Shim, V.P.W. 
Issue Date: Nov-2008
Citation: Wong, E.H., Seah, S.K.W., Shim, V.P.W. (2008-11). A review of board level solder joints for mobile applications. Microelectronics Reliability 48 (11-12) : 1747-1758. ScholarBank@NUS Repository.
Abstract: The reliability of electronics under drop-shock conditions has attracted significant interest in recent years due to the widespread use of mobile electronic products. This review focuses on the drop-impact reliability of lead-free solder joints that interconnect the integrated circuit (IC) component to the printed circuit board (PCB). Major topics covered are the physics of failure in drop-impact; the use of board level and component level test methods to evaluate drop performance; micro-damage mechanisms; failure models for life prediction under drop-impact; modelling and simulation techniques; and dynamic stress-strain properties of solder joint materials. Differential bending between the PCB and the IC component is the dominant failure driver for solder joints in portable electronics subjected to drop-impact. Board level drop-shock tests correlate well with board level high speed cyclic bending tests but not with component level ball impact shear tests. Fatigue is the micro-damage mechanism responsible for the failure of solder joints in the drop-shock of PCB assemblies and the fatigue strength of solder joints depends strongly on the strain rate, test temperature, and the sequence of loading. Finally, tin-rich lead-free solders exhibit significantly higher strain rate sensitivity than eutectic SnPb solder. © 2008 Elsevier Ltd. All rights reserved.
Source Title: Microelectronics Reliability
ISSN: 00262714
DOI: 10.1016/j.microrel.2008.08.006
Appears in Collections:Staff Publications

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