Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/67473
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dc.titleLow-temperature graft copolymerization of 1-vinyl imidazole on low-density polyethylene films with simultaneous lamination of copper foils
dc.contributor.authorHan, H.S.
dc.contributor.authorTan, K.L.
dc.contributor.authorKang, E.T.
dc.contributor.authorNeoh, K.G.
dc.date.accessioned2014-06-17T10:01:42Z
dc.date.available2014-06-17T10:01:42Z
dc.date.issued1998
dc.identifier.citationHan, H.S.,Tan, K.L.,Kang, E.T.,Neoh, K.G. (1998). Low-temperature graft copolymerization of 1-vinyl imidazole on low-density polyethylene films with simultaneous lamination of copper foils. Journal of Applied Polymer Science 70 (10) : 1977-1983. ScholarBank@NUS Repository.
dc.identifier.issn00218995
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/67473
dc.description.abstractSurface modification of argon plasma-pretreated low-density polyethylence (LDPE) films by graft copolymerizatiao with 1-vinyl imidazole (VIDz) and with concurrent lamination of copper foils at room temperature and at an elevated temperature were carried out. The adhesion strengths were reported as lap shear adhesion strengths and T-peel strengths. The surfaces of the graft copolymerized films and the mechanitally delaminated LDPE and Cu surfaces were characterized by X-ray photoelectron spectroscopy (XPS). It was found that plasma pretreatment of LDPE alone, and in the absence of VIDz, could give rise to strong lap shear adhesion between the polymer and copper. Significant T-peel strengths, however, were obtained only for LDPE/Cu laminates obtained from the simultaneous graft copotymerization and lamination technique. © 19986 John Wiley & Sons, Inc.
dc.sourceScopus
dc.subject1-vinyl imidazole
dc.subjectCopper, lamination: Grafting
dc.subjectLDPE
dc.subjectPeel strength
dc.typeArticle
dc.contributor.departmentPHYSICS
dc.contributor.departmentCHEMICAL ENGINEERING
dc.description.sourcetitleJournal of Applied Polymer Science
dc.description.volume70
dc.description.issue10
dc.description.page1977-1983
dc.description.codenJAPNA
dc.identifier.isiutNOT_IN_WOS
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