Please use this identifier to cite or link to this item: https://doi.org/10.1016/S0020-7683(02)00081-1
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dc.titleAnalytical solution for free vibration of piezoelectric coupled moderately thick circular plates
dc.contributor.authorLiu, X.
dc.contributor.authorWang, Q.
dc.contributor.authorQuek, S.T.
dc.date.accessioned2014-06-17T08:13:36Z
dc.date.available2014-06-17T08:13:36Z
dc.date.issued2002-04-12
dc.identifier.citationLiu, X., Wang, Q., Quek, S.T. (2002-04-12). Analytical solution for free vibration of piezoelectric coupled moderately thick circular plates. International Journal of Solids and Structures 39 (8) : 2129-2151. ScholarBank@NUS Repository. https://doi.org/10.1016/S0020-7683(02)00081-1
dc.identifier.issn00207683
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/65152
dc.description.abstractAn analytical model for free vibration analysis of piezoelectric coupled moderately thick circular plate is presented based on Mindlin's plate theory for the cases where electrodes on the piezoelectric layers are shortly connected. The distribution of electric potential along the thickness direction is simulated by a sinusoidal function. The differential equations of motion are solved analytically for two boundary conditions of the plate: clamped edge and simply supported edge. The detailed mathematical derivations are presented. Numerical investigations are performed for plates with two surface-bonded piezoelectric layers for various diameter-thickness ratios and the results are verified by those obtained from three-dimensional finite element analyses (ABAQUS 6.1). © 2002 Published by Elsevier Science Ltd.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/S0020-7683(02)00081-1
dc.sourceScopus
dc.subjectAnalytical
dc.subjectElectric potential
dc.subjectMindlin
dc.subjectPiezoelectric
dc.subjectPlate
dc.typeArticle
dc.contributor.departmentCIVIL ENGINEERING
dc.description.doi10.1016/S0020-7683(02)00081-1
dc.description.sourcetitleInternational Journal of Solids and Structures
dc.description.volume39
dc.description.issue8
dc.description.page2129-2151
dc.identifier.isiut000175669900004
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