Please use this identifier to cite or link to this item: https://doi.org/10.1063/1.3009318
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dc.titleHighly textured SmCo5 (001) thin film with high coercivity
dc.contributor.authorChen, J.S.
dc.contributor.authorZhang, L.N.
dc.contributor.authorHu, J.F.
dc.contributor.authorDing, J.
dc.date.accessioned2014-06-17T07:58:51Z
dc.date.available2014-06-17T07:58:51Z
dc.date.issued2008
dc.identifier.citationChen, J.S., Zhang, L.N., Hu, J.F., Ding, J. (2008). Highly textured SmCo5 (001) thin film with high coercivity. Journal of Applied Physics 104 (9) : -. ScholarBank@NUS Repository. https://doi.org/10.1063/1.3009318
dc.identifier.issn00218979
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/64904
dc.description.abstractThe seedlayer effect on crystallographic structure and magnetic properties of cosputtered SmCo films on Cu underlayer was investigated. Highly textured (001) SmCo5 thin films were obtained by introducing a thin Ti or Ta seedlayer. Especially, with the Ta seedlayer, the half maximum of the rocking curve of SmCo (001) peak was as small as 3.4° and the high-index SmCo5 (003) diffraction peak was clearly observed, showing a high quality of texture and crystallinity. The SmCo5 films showed a large perpendicular anisotropy with out-of-plane coercivities over 20 kOe. Well crystallized SmCo5 films with (001) texture could be obtained at a temperature as low as 325 °C. The crystallinity, (001) texture, and magnetic properties of SmCo5 thin films were found to be dependent on deposition temperature, the texture of the Cu (111) underlayer, roughness of the Cu underlayer, and formation of SmCoCu alloy through the Cu diffusion. © 2008 American Institute of Physics.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1063/1.3009318
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMATERIALS SCIENCE AND ENGINEERING
dc.description.doi10.1063/1.3009318
dc.description.sourcetitleJournal of Applied Physics
dc.description.volume104
dc.description.issue9
dc.description.page-
dc.description.codenJAPIA
dc.identifier.isiut000260941700072
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