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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/62769
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dc.titleSimplified method for high-power MMIC thermal simulation
dc.contributor.authorBao, M.J.
dc.contributor.authorOoi, B.L.
dc.contributor.authorKooi, P.S.
dc.contributor.authorLi, L.W.
dc.contributor.authorLeong, M.S.
dc.contributor.authorZhou, X.D.
dc.contributor.authorXu, Q.J.
dc.date.accessioned2014-06-17T06:54:40Z
dc.date.available2014-06-17T06:54:40Z
dc.date.issued1999
dc.identifier.citationBao, M.J.,Ooi, B.L.,Kooi, P.S.,Li, L.W.,Leong, M.S.,Zhou, X.D.,Xu, Q.J. (1999). Simplified method for high-power MMIC thermal simulation. Asia-Pacific Microwave Conference Proceedings, APMC 2 : 512-515. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/62769
dc.description.abstractThe temperature distribution of multiple heat-sources in materials with temperature dependent thermal conductivity has been derived. The method involves the application of the Kirchhoff transformation, the method of images, the adaptive method and the inverse Kirchhoff transformation. The agreement between this method and the accurate direct method is within 1%, and the computation time is much less than the traditional method.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL ENGINEERING
dc.description.sourcetitleAsia-Pacific Microwave Conference Proceedings, APMC
dc.description.volume2
dc.description.page512-515
dc.description.coden00280
dc.identifier.isiutNOT_IN_WOS
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