Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/62499
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dc.titleNovel method for Simultaneous Switching Noise analysis in electronic packages
dc.contributor.authorJin, Zhang
dc.contributor.authorIyer, Mahadevan K.
dc.contributor.authorOoi, Ban Leong
dc.contributor.authorLeong, Mook Seng
dc.date.accessioned2014-06-17T06:51:44Z
dc.date.available2014-06-17T06:51:44Z
dc.date.issued1998
dc.identifier.citationJin, Zhang,Iyer, Mahadevan K.,Ooi, Ban Leong,Leong, Mook Seng (1998). Novel method for Simultaneous Switching Noise analysis in electronic packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 95-98. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/62499
dc.description.abstractIn this paper, a novel method is described for Simultaneous Switching Noise (SSN) analysis in a 208 pin Plastic Quad Flat Package (PQFP). A two-port S matrix of the pin, and the coupling between the pins are modelled by analytical equations. SSN is analyzed as a function of switching drivers and switching time. Numerical results are presented in this paper. The application of Microwave Design System (MDS) and High Frequency Structure Simulator (HFSS) for modelling and simulating of SSN are presented in this paper.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.contributor.departmentELECTRICAL ENGINEERING
dc.description.sourcetitleProceedings of the Electronic Packaging Technology Conference, EPTC
dc.description.page95-98
dc.description.coden00313
dc.identifier.isiutNOT_IN_WOS
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