Please use this identifier to cite or link to this item: https://doi.org/10.1016/0038-1101(94)E0040-L
DC FieldValue
dc.titleCharacterization of the gate oxide thickness and the channel length dependencies of hot-carrier degradation in LDD p-MOSFETs
dc.contributor.authorPan, Y.
dc.contributor.authorNg, K.K.
dc.date.accessioned2014-06-17T06:45:36Z
dc.date.available2014-06-17T06:45:36Z
dc.date.issued1995
dc.identifier.citationPan, Y., Ng, K.K. (1995). Characterization of the gate oxide thickness and the channel length dependencies of hot-carrier degradation in LDD p-MOSFETs. Solid-State Electronics 38 (1) : 183-187. ScholarBank@NUS Repository. https://doi.org/10.1016/0038-1101(94)E0040-L
dc.identifier.issn00381101
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/61932
dc.description.abstractThe gate oxide thickness and the channel length dependencies of the hot-carrier induced degradation in buried-channel LDDp-MOSFETs are characterized for the first time. On one hand, the scaling of the channel length enhances the hot-carrier injection. On the other hand, a reduction in the gate oxide thickness improves the hot-carrier immunity. Our finding reveals that the scaling of the LDD p-MOSFETs does not necessarily lead to a reduction in the hot carrier hardness as long as a sufficiently thin gate oxide is utilized. A simple analytical model for the p-MOSFET degradation indicates that the improvement in the hot carrier hardness for the devices with thinner gate oxides may be attributed to the reduction in the total number of traps in the oxide.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/0038-1101(94)E0040-L
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL ENGINEERING
dc.description.doi10.1016/0038-1101(94)E0040-L
dc.description.sourcetitleSolid-State Electronics
dc.description.volume38
dc.description.issue1
dc.description.page183-187
dc.description.codenSSELA
dc.identifier.isiutA1995QC42000027
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