Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/61726
DC FieldValue
dc.titleA theoretical model for laser cleaning of microparticles in a thin liquid layer
dc.contributor.authorLu, Y.-F.
dc.contributor.authorZhang, Y.
dc.contributor.authorSong, W.-D.
dc.contributor.authorChan, D.S.H.
dc.date.accessioned2014-06-17T06:43:18Z
dc.date.available2014-06-17T06:43:18Z
dc.date.issued1998-11-01
dc.identifier.citationLu, Y.-F.,Zhang, Y.,Song, W.-D.,Chan, D.S.H. (1998-11-01). A theoretical model for laser cleaning of microparticles in a thin liquid layer. Japanese Journal of Applied Physics, Part 2: Letters 37 (11 PART A) : L1330-L1332. ScholarBank@NUS Repository.
dc.identifier.issn00214922
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/61726
dc.description.abstractA theoretical model for removal of tiny particles from solid surface by laser cleaning with a thin liquid layer is established by taking adhesion force and cleaning force into account. When pulsed laser irradiates on the solid surface coated with a thin liquid film, a sheet of liquid near the liquid/substrate interface can be superheated through thermal diffusion. The rapid growth of vapor bubbles inside the superheated liquid can generate transient stress wave with high pressure, large enough to expel micron and sub-micron particles from the contaminated surface. Through calculating adhesion force and cleaning force, the cleaning threshold of laser fluence can be predicted from this theoretical model and the difference between cleaning force and adhesion force increases with increasing of laser fluence, leading to higher cleaning efficiency.
dc.sourceScopus
dc.subjectAdhesion force
dc.subjectCleaning force
dc.subjectSaturation vapor pressure
dc.subjectSteam laser cleaning
dc.subjectStress wave
dc.typeArticle
dc.contributor.departmentELECTRICAL ENGINEERING
dc.contributor.departmentDATA STORAGE INSTITUTE
dc.description.sourcetitleJapanese Journal of Applied Physics, Part 2: Letters
dc.description.volume37
dc.description.issue11 PART A
dc.description.pageL1330-L1332
dc.description.codenJAPLD
dc.identifier.isiutNOT_IN_WOS
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