Please use this identifier to cite or link to this item: https://doi.org/10.1149/1.2051954
DC FieldValue
dc.titleWear phenomena in abrasive-free copper CMP process
dc.contributor.authorBalakumar, S.
dc.contributor.authorHaque, T.
dc.contributor.authorKumar, A.S.
dc.contributor.authorRahman, M.
dc.contributor.authorKumar, R.
dc.date.accessioned2014-06-17T06:38:14Z
dc.date.available2014-06-17T06:38:14Z
dc.date.issued2005
dc.identifier.citationBalakumar, S., Haque, T., Kumar, A.S., Rahman, M., Kumar, R. (2005). Wear phenomena in abrasive-free copper CMP process. Journal of the Electrochemical Society 152 (11) : G867-G874. ScholarBank@NUS Repository. https://doi.org/10.1149/1.2051954
dc.identifier.issn00134651
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/61696
dc.description.abstractThe role of process parameters in wear mechanisms of abrasive-free copper chemical mechanical planarization (CMP) process has been investigated in this study. Qualitative analyses were performed to figure out the wear mechanisms by using scanning electron microscopy, atomic force microscopy, and energy-dispersive X-ray. Also, quantitative analysis was performed using the material removal rate model of abrasive-free CMP process. Chemical etching (corrosive wear), fatigue wear, particle adhesion, and abrasion wear have been found as the wear mechanisms in abrasive-free copper CMP, and sliding-induced chemical etching has been established as the dominant wear mechanism by both qualitative and quantitative analysis. However, increase of pressure and decrease of relative velocity and slurry flow rate give the dominance of chemical wear, and vice versa. In addition, some sort of incomplete growth and faceting of cupric layer have been observed on the wafer at some polishing conditions. © 2005 The Electrochemical Society. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1149/1.2051954
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1149/1.2051954
dc.description.sourcetitleJournal of the Electrochemical Society
dc.description.volume152
dc.description.issue11
dc.description.pageG867-G874
dc.description.codenJESOA
dc.identifier.isiut000233133700069
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