Transient cooling of electronics using phase change material (PCM)-based heat sinks

Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.applthermaleng.2007.06.010

Title:	Transient cooling of electronics using phase change material (PCM)-based heat sinks
Authors:	Kandasamy, R. Wang, X.-Q. Mujumdar, A.S.
Keywords:	Electronics cooling Heat sink Phase change materials Thermal management
Issue Date:	Jun-2008
Citation:	Kandasamy, R., Wang, X.-Q., Mujumdar, A.S. (2008-06). Transient cooling of electronics using phase change material (PCM)-based heat sinks. Applied Thermal Engineering 28 (8-9) : 1047-1057. ScholarBank@NUS Repository. https://doi.org/10.1016/j.applthermaleng.2007.06.010
Abstract:	Use of a phase change material (PCM)-based heat sink in transient thermal management of plastic quad flat package (QFP) electronic devices was investigated experimentally and numerically. Results show that increased power inputs enhance the melting rate as well as the thermal performance of the PCM-based heat sinks until the PCM is fully melted. A three-dimensional computational fluid dynamics model was proposed to simulate the problem and demonstrated good agreement with experimental data. Results indicate the potential for PCM-based heat sinks for use in intermittent-use devices. © 2007 Elsevier Ltd. All rights reserved.
Source Title:	Applied Thermal Engineering
URI:	http://scholarbank.nus.edu.sg/handle/10635/61607
ISSN:	13594311
DOI:	10.1016/j.applthermaleng.2007.06.010
Appears in Collections:	Staff Publications

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