Please use this identifier to cite or link to this item: https://doi.org/10.1088/0960-1317/13/3/319
DC FieldValue
dc.titleSingular elements for electro-mechanical coupling analysis of micro-devices
dc.contributor.authorOng, E.T.
dc.contributor.authorLee, K.H.
dc.contributor.authorLim, K.M.
dc.date.accessioned2014-06-17T06:33:42Z
dc.date.available2014-06-17T06:33:42Z
dc.date.issued2003-05
dc.identifier.citationOng, E.T., Lee, K.H., Lim, K.M. (2003-05). Singular elements for electro-mechanical coupling analysis of micro-devices. Journal of Micromechanics and Microengineering 13 (3) : 482-490. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/13/3/319
dc.identifier.issn09601317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/61321
dc.description.abstractThe boundary element method is widely used in the electrostatic analysis of micro-electro-mechanical systems (MEMS) in order to determine the capacitance and electrostatic forces. However, the standard elements with low-order polynomial basis functions cannot produce accurate solutions in the vicinity of sharp corners and edges. This paper describes the formulation of new singular elements and their application to electromechanical coupling analysis. These singular elements are specially designed to handle the singularities in the potential gradient at sharp corners and edges, thereby improving the accuracy of the electrostatic analysis of the simulations of MEMS devices. Numerical simulations of micro-beam switches, comb-drive and micro-mirror are conducted, and the effects of using the singular elements are investigated.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1088/0960-1317/13/3/319
dc.description.sourcetitleJournal of Micromechanics and Microengineering
dc.description.volume13
dc.description.issue3
dc.description.page482-490
dc.description.codenJMMIE
dc.identifier.isiut000182979600019
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