Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2004.11.183
DC FieldValue
dc.titleSimulation of surface evolution of quantum dot using meshfree approximation
dc.contributor.authorQuek, S.S.
dc.contributor.authorLiu, G.R.
dc.date.accessioned2014-06-17T06:33:33Z
dc.date.available2014-06-17T06:33:33Z
dc.date.issued2005-05-23
dc.identifier.citationQuek, S.S., Liu, G.R. (2005-05-23). Simulation of surface evolution of quantum dot using meshfree approximation. Thin Solid Films 479 (1-2) : 297-309. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.11.183
dc.identifier.issn00406090
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/61308
dc.description.abstractAn ideal way of fabricating quantum dots is by self-assembly that can be simulated using the Stranski-Krastanow growth mode. This paper presents a numerical scheme to simulate the morphology of the quantum dot "island" due to stresses induced by a buried quantum dot. The surface diffusion equation that governs epitaxial growth is solved for the normal surface velocity by using a meshfree interpolation technique-the moving least square method. The normal surface displacement is then deduced and the process is repeated through a difference scheme to obtain the change in surface shape as a function of time. Simulations using the present method have found that the island morphology is affected by various factors including elastic anisotropy, cap layer thickness and crystal orientation. © 2004 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.tsf.2004.11.183
dc.sourceScopus
dc.subjectMeshfree interpolation
dc.subjectQuantum dot
dc.subjectSelf-assembly
dc.subjectSimulation
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.tsf.2004.11.183
dc.description.sourcetitleThin Solid Films
dc.description.volume479
dc.description.issue1-2
dc.description.page297-309
dc.description.codenTHSFA
dc.identifier.isiut000228372100043
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