Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.electacta.2006.09.022
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dc.titleElectrical and thermal characterization of a dielectrophoretic chip with 3D electrodes for cells manipulation
dc.contributor.authorTay, F.E.H.
dc.contributor.authorYu, L.
dc.contributor.authorPang, A.J.
dc.contributor.authorIliescu, C.
dc.date.accessioned2014-06-17T06:19:37Z
dc.date.available2014-06-17T06:19:37Z
dc.date.issued2007-02-10
dc.identifier.citationTay, F.E.H., Yu, L., Pang, A.J., Iliescu, C. (2007-02-10). Electrical and thermal characterization of a dielectrophoretic chip with 3D electrodes for cells manipulation. Electrochimica Acta 52 (8 SPEC. ISS.) : 2862-2868. ScholarBank@NUS Repository. https://doi.org/10.1016/j.electacta.2006.09.022
dc.identifier.issn00134686
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/60135
dc.description.abstractThis paper presents a characterization of a DEP device with 3D electrodes fabricated using microtechnology. A characteristic of the proposed DEP device is that the microchannel walls are made from heavy-doped silicon, acting simultaneously as electrodes. Theoretical analysis shows that the structure with 3D electrodes presents a uniform DEP force in the cross-section of the microfluidic channel, hence producing a higher trapping efficiency compared to those classical DEP devices with thin planar electrodes. Numerical simulation using finite element method (ANSYS) has demonstrated that with 3D silicon electrodes, the change in temperature is 8-10 times lower as compared to those classical DEP devices with thin planar electrodes. Experimental results show that DEP device with 3D silicon electrodes has a better trapping efficiency of cells, hence providing a great potential for high volume cells manipulation. © 2006 Elsevier Ltd. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.electacta.2006.09.022
dc.sourceScopus
dc.subjectBiochip
dc.subjectBioMEMS
dc.subjectDielectrophoresis
dc.subjectLab-on-a-chip
dc.subjectParticle manipulation
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.electacta.2006.09.022
dc.description.sourcetitleElectrochimica Acta
dc.description.volume52
dc.description.issue8 SPEC. ISS.
dc.description.page2862-2868
dc.description.codenELCAA
dc.identifier.isiut000244552300016
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