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Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.sna.2005.07.006
DC FieldValue
dc.titleCharacterization of localized laser assisted eutectic bonds
dc.contributor.authorTan, A.W.Y.
dc.contributor.authorTay, F.E.H.
dc.contributor.authorZhang, J.
dc.date.accessioned2014-06-17T06:14:32Z
dc.date.available2014-06-17T06:14:32Z
dc.date.issued2006-01-10
dc.identifier.citationTan, A.W.Y., Tay, F.E.H., Zhang, J. (2006-01-10). Characterization of localized laser assisted eutectic bonds. Sensors and Actuators, A: Physical 125 (2) : 573-585. ScholarBank@NUS Repository. https://doi.org/10.1016/j.sna.2005.07.006
dc.identifier.issn09244247
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/59697
dc.description.abstractAn innovative bonding process for silicon and single crystal quartz has been developed and investigated using various material science characterization methods, such as TOF-SIMS, SEM, EDX and XRD. The bonding process combines the principles of laser transmission welding, eutectic bonding and bonding by localized heating. A focused laser beam (low power, max. 0.83 W) is transmitted through a quartz medium to intermediate layers of chromium, gold and tin at the silicon-quartz interface to provide localized heating and bonding. This bonding process is particularly suitable for bonding wafers containing temperature sensitive devices as it confines the temperature increase to a small area. Bond strength of over 15 MPa is comparable to most localized bonding schemes. This process provides a simple yet robust bonding solution with rapid processing time, selectivity of bonded area and corrosion resistant joints. © 2005 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.sna.2005.07.006
dc.sourceScopus
dc.subjectEutectic
dc.subjectGold-tin
dc.subjectInterfacial characterization
dc.subjectLaser bonding
dc.subjectLow temperature
dc.subjectSingle crystal quartz-to-silicon
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.sna.2005.07.006
dc.description.sourcetitleSensors and Actuators, A: Physical
dc.description.volume125
dc.description.issue2
dc.description.page573-585
dc.description.codenSAAPE
dc.identifier.isiut000234535400065
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