Please use this identifier to cite or link to this item:
https://doi.org/10.1109/TADVP.2009.2025222
DC Field | Value | |
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dc.title | Analytical solutions for PCB assembly subjected to mismatched thermal expansion | |
dc.contributor.author | Wong, E.H. | |
dc.contributor.author | Lim, K.M. | |
dc.contributor.author | Mai, Y.-W. | |
dc.date.accessioned | 2014-06-17T06:12:38Z | |
dc.date.available | 2014-06-17T06:12:38Z | |
dc.date.issued | 2009 | |
dc.identifier.citation | Wong, E.H., Lim, K.M., Mai, Y.-W. (2009). Analytical solutions for PCB assembly subjected to mismatched thermal expansion. IEEE Transactions on Advanced Packaging 32 (3) : 602-611. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2009.2025222 | |
dc.identifier.issn | 15213323 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/59538 | |
dc.description.abstract | Thermal stress due to mismatched thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literature for a tri-material in which the sandwiched layer is an adhesive, but the solutions may not be suitable for a sandwiched layer consisting of discrete elements such as solder joints which experience significant bending. In this paper, closed-form analytical solutions have been developed for both continuous and discrete sandwiched layers by modelling the interconnects as a slab of spring elements capable of transferring axial, shear, and bending load. The analytical solutions have been successfully validated with finite element analysis. © 2009 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TADVP.2009.2025222 | |
dc.source | Scopus | |
dc.subject | Analytical solutions | |
dc.subject | Electronics packaging | |
dc.subject | Solder joints | |
dc.subject | Thermal stress | |
dc.type | Article | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.description.doi | 10.1109/TADVP.2009.2025222 | |
dc.description.sourcetitle | IEEE Transactions on Advanced Packaging | |
dc.description.volume | 32 | |
dc.description.issue | 3 | |
dc.description.page | 602-611 | |
dc.description.coden | ITAPF | |
dc.identifier.isiut | 000268757000004 | |
Appears in Collections: | Staff Publications |
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