Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/57398
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dc.titleSilicon nanowire forthermoelectric applications: Effects of contact resistance
dc.contributor.authorLi, Y.
dc.contributor.authorBuddharaju, K.
dc.contributor.authorSingh, N.
dc.contributor.authorLo, G.Q.
dc.contributor.authorLee, S.J.
dc.date.accessioned2014-06-17T03:05:45Z
dc.date.available2014-06-17T03:05:45Z
dc.date.issued2011-09
dc.identifier.citationLi, Y.,Buddharaju, K.,Singh, N.,Lo, G.Q.,Lee, S.J. (2011-09). Silicon nanowire forthermoelectric applications: Effects of contact resistance. World Academy of Science, Engineering and Technology 81 : 642-645. ScholarBank@NUS Repository.
dc.identifier.issn2010376X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/57398
dc.description.abstractSilicon nanowire (SiNW) based thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting. It is a great challenge however, to assemble an efficient device with these SiNW. The presence of parasitic in the form of interfacial electrical resistance will have a significant impact on the performance of the TED. In this work, we explore the effect of the electrical contact resistance on the performance of a TED. Numerical simulations are performed on SiNW to investigate such effects on its cooling performance. Intrinsically, SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance.
dc.sourceScopus
dc.subjectElectrical contact resistance
dc.subjectNanowire
dc.subjectParasitics
dc.subjectSilicon
dc.subjectThermoelectric
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.sourcetitleWorld Academy of Science, Engineering and Technology
dc.description.volume81
dc.description.page642-645
dc.identifier.isiutNOT_IN_WOS
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