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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/57077
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dc.titlePlastic ball grid array reflow using a fast-modulated CW laser
dc.contributor.authorLiu, D.
dc.contributor.authorLu, Y.-F.
dc.contributor.authorYuan, Y.
dc.contributor.authorChen, T.
dc.contributor.authorPrematilleke, L.
dc.date.accessioned2014-06-17T03:01:59Z
dc.date.available2014-06-17T03:01:59Z
dc.date.issued2001-01
dc.identifier.citationLiu, D.,Lu, Y.-F.,Yuan, Y.,Chen, T.,Prematilleke, L. (2001-01). Plastic ball grid array reflow using a fast-modulated CW laser. Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers 40 (1) : 177-182. ScholarBank@NUS Repository.
dc.identifier.issn00214922
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/57077
dc.description.abstractPlastic ball grid array reflow using a fast-modulated CW laser is studied. A CW/Q-switched Nd:YAG laser is modified to work in the fast-modulated CW mode. Sn-Pb eutectic solder balls with a diameter of 760 μm and Au-Ni-Cu solder pads are used in the study. By varying the laser power and the laser-on time, respectively, the solderable parameter region of laser reflow for the solder balls and the solder pads is obtained. Shear strength tests are also performed to find out the optimal reflow parameters. The measured shear strength is higher than 1500 gf, with the maximum value over 1900 gf. An energy equilibrium model is proposed to compare the solderable region predicted theoretically with the experimental results and to estimate the average temperatures of solder joint under the given experimental conditions.
dc.sourceScopus
dc.subjectLaser reflow
dc.subjectPlastic ball grid array
dc.subjectSn-Pb eutectic solder ball
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.sourcetitleJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
dc.description.volume40
dc.description.issue1
dc.description.page177-182
dc.description.codenJAPND
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

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