Please use this identifier to cite or link to this item:
https://scholarbank.nus.edu.sg/handle/10635/56230
DC Field | Value | |
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dc.title | Hybrid laser processing for microfabrication of glass | |
dc.contributor.author | Sugioka, K. | |
dc.contributor.author | Obata, K. | |
dc.contributor.author | Hong, M.H. | |
dc.contributor.author | Wu, D.J. | |
dc.contributor.author | Wong, L.L. | |
dc.contributor.author | Lu, Y.F. | |
dc.contributor.author | Chong, T.C. | |
dc.contributor.author | Midorikawa, K. | |
dc.date.accessioned | 2014-06-17T02:52:13Z | |
dc.date.available | 2014-06-17T02:52:13Z | |
dc.date.issued | 2003-07 | |
dc.identifier.citation | Sugioka, K.,Obata, K.,Hong, M.H.,Wu, D.J.,Wong, L.L.,Lu, Y.F.,Chong, T.C.,Midorikawa, K. (2003-07). Hybrid laser processing for microfabrication of glass. Applied Physics A: Materials Science and Processing 77 (2) : 251-257. ScholarBank@NUS Repository. | |
dc.identifier.issn | 09478396 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/56230 | |
dc.description.abstract | Hybrid laser processing for the precision microfabrication of glass materials in which the interaction of a conventional pulsed laser beam and a medium on the material surface leads to effective ablation and modification, is reviewed. A major role of the medium is to produce strong absorption of the conventional laser beam by the material. Simultaneous irradiation by a vacuum ultraviolet (VUV) laser beam that possesses an extremely small laser fluence and an ultraviolet (UV) laser greatly improves the ablation quality and modification efficiency for fused silica (VUV-UV multiwavelength excitation process). The metal plasma generated by the laser beam effectively assists high-quality ablation of transparent materials by the same laser beam, resulting in microstructuring, cutting, color marking, printing, and selective metallization of glass materials (laser-induced plasma-assisted ablation (LIPAA)). The detailed discussion presented here includes the ablation mechanism of hybrid laser processing. | |
dc.source | Scopus | |
dc.type | Article | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.sourcetitle | Applied Physics A: Materials Science and Processing | |
dc.description.volume | 77 | |
dc.description.issue | 2 | |
dc.description.page | 251-257 | |
dc.description.coden | APAMF | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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