Please use this identifier to cite or link to this item: https://doi.org/10.1109/LED.2008.923710
DC FieldValue
dc.titleDiamond-like carbon (DLC) liner: A new stressor for P-channel multiple-gate field-effect transistors
dc.contributor.authorTan, K.-M.
dc.contributor.authorFang, W.-W.
dc.contributor.authorYang, M.
dc.contributor.authorLiow, T.-Y.
dc.contributor.authorLee, R.T.-P.
dc.contributor.authorBalasubramanian, N.
dc.contributor.authorYeo, Y.-C.
dc.date.accessioned2014-06-17T02:45:20Z
dc.date.available2014-06-17T02:45:20Z
dc.date.issued2008-07
dc.identifier.citationTan, K.-M., Fang, W.-W., Yang, M., Liow, T.-Y., Lee, R.T.-P., Balasubramanian, N., Yeo, Y.-C. (2008-07). Diamond-like carbon (DLC) liner: A new stressor for P-channel multiple-gate field-effect transistors. IEEE Electron Device Letters 29 (7) : 750-752. ScholarBank@NUS Repository. https://doi.org/10.1109/LED.2008.923710
dc.identifier.issn07413106
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/55632
dc.description.abstractWe report the first demonstration of a p-channel multiple-gate (trigate) FinFET with a liner stressor comprising diamond-like carbon (DLC) film. We also report on the detailed process that enables the adhesion of DLC with ultrahigh compressive stress on the three-dimension topology of the FinFET structure. The intrinsic compressive stress for the DLC film is 6 GPa, the highest ever reported for a liner stressor formed over a multiple-gate device structure or FinFET. A high stress-thickness product was successfully realized without film delamination. This leads to a very significant drive current boost for the FinFET with DLC liner stressor as compared to a control FinFET without the DLC liner. © 2008 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/LED.2008.923710
dc.sourceScopus
dc.subjectContact etch stop layer (CESL)
dc.subjectDiamond-like carbon (DLC)
dc.subjectFinFET
dc.subjectMultiple-gate
dc.subjectStrain
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/LED.2008.923710
dc.description.sourcetitleIEEE Electron Device Letters
dc.description.volume29
dc.description.issue7
dc.description.page750-752
dc.description.codenEDLED
dc.identifier.isiut000257626000030
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