Please use this identifier to cite or link to this item: https://doi.org/10.1080/10407780802483516
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dc.titleA node-based smoothed point interpolation method (NS-PIM) for three-dimensional thermoelastic problems
dc.contributor.authorWu, S.C.
dc.contributor.authorLiu, G.R.
dc.contributor.authorZhang, H.O.
dc.contributor.authorZhang, G.Y.
dc.date.accessioned2014-06-16T09:32:24Z
dc.date.available2014-06-16T09:32:24Z
dc.date.issued2008-01
dc.identifier.citationWu, S.C., Liu, G.R., Zhang, H.O., Zhang, G.Y. (2008-01). A node-based smoothed point interpolation method (NS-PIM) for three-dimensional thermoelastic problems. Numerical Heat Transfer; Part A: Applications 54 (12) : 1121-1147. ScholarBank@NUS Repository. https://doi.org/10.1080/10407780802483516
dc.identifier.issn10407782
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/54560
dc.description.abstractA node-based smoothed point interpolation method (NS-PIM) is formulated to analyze 3-D steady-state thermoelastic problems subjected to complicated thermal and mechanical loads. Gradient smoothing technique with node-based smoothing domains is utilized to modify the gradient fields and to perform the numerical integration required in the weak form formulation. Numerical results show that NS-PIM can achieve more accurate solutions even when the 4-node tetrahedral mesh is used compared to the finite-element method (FEM) using the same mesh, especially for strains and hence stresses. Most importantly, it can produce an upper bound solution of the exact solution in energy norm for both temperature and stress fields when a reasonably fine mesh is used. Together with FEM, we now for the first time have a simple means to obtain both upper and lower bounds of the exact solution to complex thermoelastic problems.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1080/10407780802483516
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1080/10407780802483516
dc.description.sourcetitleNumerical Heat Transfer; Part A: Applications
dc.description.volume54
dc.description.issue12
dc.description.page1121-1147
dc.description.codenNHAAE
dc.identifier.isiut000261093400003
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