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|dc.title||A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects|
|dc.identifier.citation||Li, E.-P., Liu, E.-X., Li, L.-W., Leong, M.-S. (2004-02). A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects. IEEE Transactions on Advanced Packaging 27 (1) : 213-223. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2004.825448|
|dc.description.abstract||This paper presents an accurate and systematic approach for analysis of the signal integrity of the high-speed interconnects, which couples the full-wave finite difference time domain (FDTD) method with scattering (S) parameter based macromodeling by using rational function approximation and the circuit simulator. Firstly, the full-wave FDTD method is applied to characterize the interconnect subsystems, which is dedicated to extract the S parameters of the subnetwork consisting of interconnects with fairly complex geometry. Once the frequency-domain discrete data of the S parameters of the interconnect subnetwork is constructed, the rational function approximation is carried out to establish the macromodel of the interconnect subnetwork by employing the vector fitting method, which provides a more robust and accurate solution for the overall problem. Finally, the analysis of the signal integrity of the hybrid circuit can be fulfilled by using the S parameters based macromodel synthesis and simulation program with integrated circuits emphasis (SPICE) circuit simulator. Numerical experiments demonstrate that the proposed approach is accurate and efficient to address the hybrid electromagnetic (interconnect part) and circuit problems, in which the electromagnetic field effects are fully considered and the strength of SPICE circuit simulator is also exploited.|
|dc.subject||Rational function approximation|
|dc.contributor.department||ELECTRICAL & COMPUTER ENGINEERING|
|dc.description.sourcetitle||IEEE Transactions on Advanced Packaging|
|Appears in Collections:||Staff Publications|
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