Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.applthermaleng.2010.12.036
DC FieldValue
dc.titleNumerical investigation of laminar heat transfer performance of various cooling channel designs
dc.contributor.authorKurnia, J.C.
dc.contributor.authorSasmito, A.P.
dc.contributor.authorMujumdar, A.S.
dc.date.accessioned2014-04-24T09:35:51Z
dc.date.available2014-04-24T09:35:51Z
dc.date.issued2011-05
dc.identifier.citationKurnia, J.C., Sasmito, A.P., Mujumdar, A.S. (2011-05). Numerical investigation of laminar heat transfer performance of various cooling channel designs. Applied Thermal Engineering 31 (6-7) : 1293-1304. ScholarBank@NUS Repository. https://doi.org/10.1016/j.applthermaleng.2010.12.036
dc.identifier.issn13594311
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/51482
dc.description.abstractThis study addresses the heat transfer performance of various cooling channel designs e.g., parallel, serpentine, wavy, coiled and novel hybrid channels. The cooling channel is designed to be placed on top of an electronic chip which dissipates heat at a constant flux. Laminar flow of a Newtonian fluid in a square cross-section channel is investigated using a three-dimensional computational fluid dynamic approach. Five channels Reynolds number are investigated to quantify the effect of Reynolds number on the performance of the cooling channel designs. Advantages and limitations of each design are discussed in the light of numerical results. Figures of merit, viz. heat transferred per unit pumping power are compared for the wide variety of channels examined. © 2011 Elsevier Ltd. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.applthermaleng.2010.12.036
dc.sourceScopus
dc.subjectCoils
dc.subjectElectronic cooling
dc.subjectHeat transfer performance
dc.subjectMathematical model
dc.subjectNon-circular tube
dc.subjectSquare tube
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.contributor.departmentCHEMICAL & BIOMOLECULAR ENGINEERING
dc.description.doi10.1016/j.applthermaleng.2010.12.036
dc.description.sourcetitleApplied Thermal Engineering
dc.description.volume31
dc.description.issue6-7
dc.description.page1293-1304
dc.description.codenATENF
dc.identifier.isiut000288408100035
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