Please use this identifier to cite or link to this item:
https://scholarbank.nus.edu.sg/handle/10635/35266
DC Field | Value | |
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dc.title | Planar microspring integrated circuit chip interconnection to next level | |
dc.contributor | NATIONAL UNIVERSITY OF SINGAPORE | |
dc.contributor | AGENCY FOR SCIENCE, TECHNOLOGY & RESEARCH | |
dc.contributor | GEORGIA TECH RESEARCH CORPORATION | |
dc.contributor.author | TAY, ANDREW AH ONG | |
dc.contributor.author | ANG, SIMON SAW-TEONG | |
dc.contributor.author | LIAO, EBIN | |
dc.date.accessioned | 2012-11-01T05:58:10Z | |
dc.date.available | 2012-11-01T05:58:10Z | |
dc.date.issued | 2006-09-07 | |
dc.identifier.citation | TAY, ANDREW AH ONG,ANG, SIMON SAW-TEONG,LIAO, EBIN (2006-09-07). Planar microspring integrated circuit chip interconnection to next level. ScholarBank@NUS Repository. | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/35266 | |
dc.description.abstract | An interconnect structure for interconnecting an integrated circuit (IC) chip to a next level, a method of fabricating the interconnect at wafer level, and a method of interconnecting an integrated circuit (IC) chip to the next level. The interconnect structure comprises one or more planar micro-spring elements formed on a packaging surface of the chip and connected to an interconnection pad; wherein the interconnection pad is resiliently moveable horizontally and vertically with respect to the surface of the chip. A layer of solder is preferably electroplated onto the interconnection pad to provide interconnection to the next level. In a variation of the interconnect structure, a metal column is fabricated onto the interconnection pad prior to electroplating the solder layer. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/http://analytics.patsnap.com/patent_view/view?pn=US20060197232A1 | |
dc.source | PatSnap | |
dc.type | Patent | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.identifier.isiut | NOT_IN_WOS | |
dc.description.patentno | US20060197232A1 | |
dc.description.patenttype | Published Application | |
Appears in Collections: | Staff Publications |
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File | Description | Size | Format | Access Settings | Version | |
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US20060197232A1.PDF | 306.79 kB | Adobe PDF | OPEN | Published | View/Download |
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