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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/34878
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dc.titleCONTACT PRESSURE SENSOR AND METHOD FOR MANUFACTURING THE SAME
dc.contributorNATIONAL UNIVERSITY OF SINGAPORE
dc.contributor.authorAKKIPEDDI, RAMAM
dc.contributor.authorSPERRING, CHRISTOPHER PHILIP
dc.contributor.authorTOH, SIEW LOK
dc.contributor.authorTAY, CHO JUI
dc.contributor.authorRAHMAN, MUSTAFIZUR
dc.contributor.authorCHUA, SOO JIN
dc.date.accessioned2012-10-05T06:01:49Z
dc.date.available2012-10-05T06:01:49Z
dc.date.issued2006-05-03
dc.identifier.citationAKKIPEDDI, RAMAM,SPERRING, CHRISTOPHER PHILIP,TOH, SIEW LOK,TAY, CHO JUI,RAHMAN, MUSTAFIZUR,CHUA, SOO JIN (2006-05-03). CONTACT PRESSURE SENSOR AND METHOD FOR MANUFACTURING THE SAME. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/34878
dc.description.abstractA contact pressure sensor (10) and method for manufacturing a contact pressure sensor for detecting contact pressure between two surfaces is disclosed. The contact pressure sensor disclosed comprises a substrate (40) for supporting the sensor and a contact pressure sensitive layer (26) sensitive to pressure applied to the contact pressure sensor. The method disclosed also comprises transferring a process post structure (8) that is formed on a first process support substrate (20) from the first process support substrate to a second contact pressure sensor support substrate (40).
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/http://analytics.patsnap.com/patent_view/view?pn=EP1651935A1
dc.sourcePatSnap
dc.typePatent
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.identifier.isiutNOT_IN_WOS
dc.description.patentnoEP1651935A1
dc.description.patenttypePublished Application
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