Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/32575
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dc.titleMethod and apparatus to image metallic patches embedded in a non-metal surface
dc.contributor.authorCHA, CHER LIANG RANDALL
dc.contributor.authorGONG, HAO
dc.contributor.authorCHOR, ENG FONG
dc.contributor.authorCHAN, LAP
dc.date.accessioned2012-05-02T02:27:15Z
dc.date.available2012-05-02T02:27:15Z
dc.date.issued2000-05-16
dc.identifier.citationCHA, CHER LIANG RANDALL,GONG, HAO,CHOR, ENG FONG,CHAN, LAP (2000-05-16). Method and apparatus to image metallic patches embedded in a non-metal surface. ScholarBank@NUS Repository.
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/32575
dc.description.abstractSmall metallic patches embedded in a mainly non-metallic surface may be detected and mapped by placing a wire coil at the free end of a cantilever, with a fine tip made of a ferro-magnetic material located at its center. An alternating current is passed through the coil so that when it is near a metallic patch eddy currents are induced in the patch. These produce a small magnetic moment in the patch which pulls the tip towards the surface. This movement of the tip is detected by observing a light beam that is reflected off the surface of the cantilever. By plotting the output of a photodetector, sensistive to small changes in the reflected beam's position, as a function of the tip's location over the surface, a map of the metallic patches is produced.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/http://analytics.patsnap.com/patent_view/view?pn=US6064201
dc.sourcePatSnap
dc.typePatent
dc.contributor.departmentMATERIALS SCIENCE
dc.contributor.departmentELECTRICAL ENGINEERING
dc.identifier.isiutNOT_IN_WOS
dc.description.patentnoUS6064201
dc.description.patenttypeGranted Patent
dc.contributor.patentassigneeCHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SINGAPORE, SG)
dc.contributor.patentassigneeNATIONAL UNIVERSITY OF SINGAPORE
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