Nanostructuring of biomaterials and reducing implant related infections via incorporation of silver and copper as antimicrobial elements: An Overview

Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/230365

DC Field	Value
dc.title	Nanostructuring of biomaterials and reducing implant related infections via incorporation of silver and copper as antimicrobial elements: An Overview
dc.contributor.author	J. Feng
dc.contributor.author	S.Y. Tong
dc.contributor.author	Eng San Thian
dc.contributor.author	Chunguang Yang
dc.contributor.author	Ke Yang
dc.contributor.author	N. Gong
dc.contributor.author	Kamakhya Prakash Misra
dc.contributor.author	R.D.K. Misra
dc.date.accessioned	2022-08-17T08:56:20Z
dc.date.available	2022-08-17T08:56:20Z
dc.date.issued	2022-05-29
dc.identifier.citation	J. Feng, S.Y. Tong, Eng San Thian, Chunguang Yang, Ke Yang, N. Gong, Kamakhya Prakash Misra, R.D.K. Misra (2022-05-29). Nanostructuring of biomaterials and reducing implant related infections via incorporation of silver and copper as antimicrobial elements: An Overview. Materials Technology 37 (9) : 867-879. ScholarBank@NUS Repository.
dc.identifier.issn	1066-7857
dc.identifier.uri	https://scholarbank.nus.edu.sg/handle/10635/230365
dc.publisher	Taylor & Francis
dc.source	Taylor & Francis
dc.type	Article
dc.contributor.department	MECHANICAL ENGINEERING
dc.description.sourcetitle	Materials Technology
dc.description.volume	37
dc.description.issue	9
dc.description.page	867-879
Appears in Collections:	Staff Publications Elements

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