Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/227561
Title: IN-SITU METROLOGY FOR PVD ALUMINIUM FILM THICKNESS MEASUREMENT
Authors: WANG XINXIN
ORCID iD:   orcid.org/0000-0003-4347-2852
Keywords: semiconductor, PVD, Aluminum, metrology, integration, thickness
Issue Date: 11-Jan-2022
Citation: WANG XINXIN (2022-01-11). IN-SITU METROLOGY FOR PVD ALUMINIUM FILM THICKNESS MEASUREMENT. ScholarBank@NUS Repository.
Abstract: This project aims to develop a system that can be integrated to the company’s existing PVD metal thin film deposition chambers and to achieve metal thin film deposition quality control. The 1st step is to focus on Aluminum film thickness measurement on a wafer sizes 300mm in diameter, subsequently, it will extend the capability to cover other metal. The developed system with 10mm area resolution can do multiple points measurements on Aluminum film ranges from a few thousand Angstrom to a few micrometers. It has been integrated to existing production system and wafer measurement can be done without the need of wafer leaving the system. It is the first commercial product of its type from the company and it successfully ordered by one of customer.
URI: https://scholarbank.nus.edu.sg/handle/10635/227561
Appears in Collections:Master's Theses (Open)

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