Please use this identifier to cite or link to this item: https://doi.org/10.1038/s41598-019-53033-4
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dc.titleScreen Printed Passives and Interconnects on Bio-Degradable Medical Hydrocolloid Dressing for Wearable Sensors
dc.contributor.authorAlsuradi, H.
dc.contributor.authorYoo, J.
dc.date.accessioned2021-12-06T04:19:51Z
dc.date.available2021-12-06T04:19:51Z
dc.date.issued2019
dc.identifier.citationAlsuradi, H., Yoo, J. (2019). Screen Printed Passives and Interconnects on Bio-Degradable Medical Hydrocolloid Dressing for Wearable Sensors. Scientific Reports 9 (1) : 17467. ScholarBank@NUS Repository. https://doi.org/10.1038/s41598-019-53033-4
dc.identifier.issn2045-2322
dc.identifier.urihttps://scholarbank.nus.edu.sg/handle/10635/209510
dc.description.abstractThe healthcare system is undergoing a noticeable transformation from a reactive, post-disease treatment to a preventive, predictive continuous healthcare. The key enabler for such a system is a pervasive wearable platform. Several technologies have been suggested and implemented as a wearable platform, but these technologies either lack reliability, manufacturing practicability or pervasiveness. We propose a screen-printed circuit board on bio-degradable hydrocolloid dressings, which are medically used and approved, as a platform for wearable biomedical sensors to overcome the aforementioned problems. We experimentally characterize and prepare the surface of the hydrocolloid and demonstrate high-quality screen-printed passive elements and interconnects on its surface using conductive silver paste. We also propose appropriate models of the thick-film screen-printed passives, validated through measurements and FEM simulations. We further elucidate on the usage of the hydrocolloid dressing by prototyping a Wireless Power Transfer (WPT) sensor and a humidity sensor using printed spiral inductors and interdigital capacitors, respectively. © 2019, The Author(s).
dc.publisherNature Research
dc.rightsAttribution 4.0 International
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.sourceScopus OA2019
dc.typeArticle
dc.contributor.departmentELECTRICAL AND COMPUTER ENGINEERING
dc.description.doi10.1038/s41598-019-53033-4
dc.description.sourcetitleScientific Reports
dc.description.volume9
dc.description.issue1
dc.description.page17467
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