Please use this identifier to cite or link to this item: https://doi.org/10.1126/sciadv.abd8688
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dc.titleMillikelvin-resolved ambient thermography
dc.contributor.authorTang, K.
dc.contributor.authorDong, K.
dc.contributor.authorNicolai, C.J.
dc.contributor.authorLi, Y.
dc.contributor.authorLi, J.
dc.contributor.authorLou, S.
dc.contributor.authorQiu, C.-W.
dc.contributor.authorRaulet, D.H.
dc.contributor.authorYao, J.
dc.contributor.authorWu, J.
dc.date.accessioned2021-08-10T03:09:38Z
dc.date.available2021-08-10T03:09:38Z
dc.date.issued2020
dc.identifier.citationTang, K., Dong, K., Nicolai, C.J., Li, Y., Li, J., Lou, S., Qiu, C.-W., Raulet, D.H., Yao, J., Wu, J. (2020). Millikelvin-resolved ambient thermography. Science Advances 6 (50) : eabd8688. ScholarBank@NUS Repository. https://doi.org/10.1126/sciadv.abd8688
dc.identifier.issn2375-2548
dc.identifier.urihttps://scholarbank.nus.edu.sg/handle/10635/196281
dc.description.abstractThermography detects surface temperature and subsurface thermal activity of an object based on the Stefan-Boltzmann law. Impacts of the technology would be more far-reaching with finer thermal sensitivity, called noise-equivalent differential temperature (NEDT). Existing efforts to advance NEDT are all focused on improving registration of radiation signals with better cameras, driving the number close to the end of the roadmap at 20 to 40 mK. In this work, we take a distinct approach of sensitizing surface radiation against minute temperature variation of the object. The emissivity of the thermal imaging sensitizer (TIS) rises abruptly at a preprogrammed temperature, driven by a metal-insulator transition in cooperation with photonic resonance in the structure. The NEDT is refined by over 15 times with the TIS to achieve single-digit millikelvin resolution near room temperature, empowering ambient thermography for a broad range of applications such as in operando electronics analysis and early cancer screening. © 2020 The Authors.
dc.publisherAmerican Association for the Advancement of Science
dc.rightsAttribution-NonCommercial 4.0 International
dc.rights.urihttp://creativecommons.org/licenses/by-nc/4.0/
dc.sourceScopus OA2020
dc.typeArticle
dc.contributor.departmentELECTRICAL AND COMPUTER ENGINEERING
dc.description.doi10.1126/sciadv.abd8688
dc.description.sourcetitleScience Advances
dc.description.volume6
dc.description.issue50
dc.description.pageeabd8688
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