Please use this identifier to cite or link to this item:
https://doi.org/10.1109/JSSC.2019.2961855
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dc.title | A 7×7×2 mm3 8.6μW 500kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications | |
dc.contributor.author | THEAN VOON YEW, AARON | |
dc.date.accessioned | 2020-09-15T09:38:21Z | |
dc.date.accessioned | 2020-09-15T09:38:28Z | |
dc.date.available | 2020-09-15T09:38:21Z | |
dc.date.issued | 2020-01-08 | |
dc.identifier.citation | THEAN VOON YEW, AARON (2020-01-08). A 7×7×2 mm3 8.6μW 500kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications. Journal of Solid State Circuits 55 (6) : 1698 - 1708. ScholarBank@NUS Repository. https://doi.org/10.1109/JSSC.2019.2961855 | |
dc.identifier.issn | 1558173X | |
dc.identifier.uri | https://scholarbank.nus.edu.sg/handle/10635/176261 | |
dc.description.abstract | A transmitter (TX)/receiver (RX) pair using galvanic coupling to achieve in-body to on-body body channel communication (I2O-BCC) for ultra-low power (ULP) miniaturized implanted applications is presented. The I2O-BCC enables low loss communication (<40 dB) within 10–40 MHz band and up to 10-cm in vivo communication distance using the body as a transmission medium. Injection locking (IL)-based frequency-to-amplitude (F2A) conversion demodulator is proposed in RX. It can handle more than 20% frequency variations exhibited by the TX frequency-shift keying (FSK) signals due to the lack of accurate off-chip reference. The packaged implanted TX measures 7 × 7 × 2 mm3. It contains a micro-battery, two micro-probes, and the designed SoC in 130-nm CMOS process. The in-body TX radio block consumes only 8.6 µW at 500 kb/s with an on-chip power management unit that exhibits a 45% power efficiency, while the on-body RX consumes 591.5 µW. The TX radio block power is 8× lower than previous works and achieves energy efficiency at 17.2 pJ/b with minimal bill of material (BOM). | |
dc.publisher | IEEE | |
dc.type | Article | |
dc.contributor.department | ELECTRICAL AND COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/JSSC.2019.2961855 | |
dc.description.sourcetitle | Journal of Solid State Circuits | |
dc.description.volume | 55 | |
dc.description.issue | 6 | |
dc.description.page | 1698 - 1708 | |
dc.published.state | Published | |
dc.grant.id | NRF-RSS2015-003 | |
dc.grant.fundingagency | NRF | |
Appears in Collections: | Staff Publications Elements |
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08952674.pdf | 4.25 MB | Adobe PDF | OPEN | Post-print | View/Download |
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