Please use this identifier to cite or link to this item: https://doi.org/10.1007/s11465-018-0504-z
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dc.titleA review on ductile mode cutting of brittle materials
dc.contributor.authorAntwi, E.K
dc.contributor.authorLiu, K
dc.contributor.authorWang, H
dc.date.accessioned2020-09-14T07:51:38Z
dc.date.available2020-09-14T07:51:38Z
dc.date.issued2018
dc.identifier.citationAntwi, E.K, Liu, K, Wang, H (2018). A review on ductile mode cutting of brittle materials. Frontiers of Mechanical Engineering 13 (2) : 251-263. ScholarBank@NUS Repository. https://doi.org/10.1007/s11465-018-0504-z
dc.identifier.issn2095-0233
dc.identifier.urihttps://scholarbank.nus.edu.sg/handle/10635/176045
dc.description.abstractBrittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously. © 2018, The Author(s).
dc.sourceUnpaywall 20200831
dc.typeReview
dc.contributor.departmentDEPT OF MECHANICAL ENGINEERING
dc.description.doi10.1007/s11465-018-0504-z
dc.description.sourcetitleFrontiers of Mechanical Engineering
dc.description.volume13
dc.description.issue2
dc.description.page251-263
dc.published.statePublished
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