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https://scholarbank.nus.edu.sg/handle/10635/158871
| Title: | ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING | Authors: | NG WEI CHIN | Keywords: | UBM EN zincation acid stripping bond pads surface morphology |
Issue Date: | 2000 | Citation: | NG WEI CHIN (2000). ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING. ScholarBank@NUS Repository. | URI: | https://scholarbank.nus.edu.sg/handle/10635/158871 |
| Appears in Collections: | Master's Theses (Restricted) |
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| b22336060.PDF | 8.42 MB | Adobe PDF | RESTRICTED | None | Log In |
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