Please use this identifier to cite or link to this item:
https://scholarbank.nus.edu.sg/handle/10635/158871
DC Field | Value | |
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dc.title | ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING | |
dc.contributor.author | NG WEI CHIN | |
dc.date.accessioned | 2019-09-16T02:41:34Z | |
dc.date.available | 2019-09-16T02:41:34Z | |
dc.date.issued | 2000 | |
dc.identifier.citation | NG WEI CHIN (2000). ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING. ScholarBank@NUS Repository. | |
dc.identifier.uri | https://scholarbank.nus.edu.sg/handle/10635/158871 | |
dc.source | CCK BATCHLOAD 20190911 | |
dc.subject | UBM | |
dc.subject | EN | |
dc.subject | zincation | |
dc.subject | acid stripping | |
dc.subject | bond pads | |
dc.subject | surface morphology | |
dc.type | Thesis | |
dc.contributor.department | CIVIL ENGINEERING | |
dc.contributor.supervisor | KO TZE-MAN | |
dc.description.degree | Master's | |
dc.description.degreeconferred | MASTER OF ENGINEERING | |
Appears in Collections: | Master's Theses (Restricted) |
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